Precision Polyimide Ball Transfer Unit with SiC or PI Ball for Semiconductor Equipment

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Description

Precision Polyimide Ball Transfer Unit with SiC or PI Ball for Semiconductor EquipmentPrecision Polyimide Ball Transfer Unit This miniature Polyimide (PI) Ball Transfer Unit is designed for semiconductor equipment, cleanroom automation systems, and precision positioning applications. The housing is CNC machined from high performance polyimide material and features a threaded mounting design for secure installation. The freely rotating ball provides smooth and stable movement while minimizing friction during transfer operations. Ball

Structure: 100% Non-Metallic

Non-metal contamination free

Ensures accurate ball positioning

Prototype and production quantities are supported

Ball material options include Silicon Carbide (SiC) for superior wear resistance and Polyimide (PI) for non-metal contact and low particle generation

PEEK Inner & Outer Rings

and nylon cage for stable guiding performance and smooth rotation

semiconductor wafer and solar silicon wafer

They are widely used in hot runner systems for reducing heat transfer

Custom dimensions and structures

High dimensional stability

Smooth surface & burr-free finish