NVIDIA/Mellanox MCP4Y10-N001 Compatible DAC 1m (3ft) Twin-port 800Gb/s OSFP Finned Top to 800Gb/s OSFP Finned Top Passive Copper Cable

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NVIDIA/Mellanox MCP4Y10-N001 Compatible DAC 1m (3ft) Twin-port 800Gb/s OSFP Finned Top to 800Gb/s OSFP Finned Top Passive Copper CableDescription NADDOD OSFP 800G CU1 is an 800Gb s twin port OSFP (Octal Small Formfactor Pluggable) to 800Gb s twin port OSFP Direct Attached Copper cable (DAC). DAC cables are the lowest cost, lowest latency, near zero power consuming, high speed links available due to their simplicity of design and minimal components. Using the Octal Small Formfactor Plug (OSFP) and containing eight high speed electrical copper pairs, each operating at data rates of up

It utilizes high-quality passive copper to deliver low-latency performance without the thermal load of active transceivers

The 400G QSFP-DD SR4 optical transceiver delivers ultra-high-density 400 Gigabit Ethernet connectivity for data centers and high-performance computing (HPC) networks

5m (5ft) single-mode (OS2) jumper featuring dual MPO-12 APC female connectors for high-density 12-fiber connectivity

NADDOD NVIDIA/Mellanox compatible OSFP-800G-2xFR4L optical transceiver is a high-speed

it is compatible with NVIDIA SN5610 Series switch

This 1-meter passive copper assembly offers a versatile and cost-effective solution for short-range 400G form factor bridging in multi-vendor environments

Designed for short-reach networking

it ensures consistent 400Gb/s throughput with ultra-low latency and zero power consumption

It is constructed with passive copper twinax to ensure reliable aggregated 100Gb/s signal transmission with ultra-low latency and zero power overhead

NADDOD OSFP-800G-CUBFTH is a 2x400Gb/s Finned Top twin-port OSFP (Octal Small Formfactor Pluggable) to 2x400Gb/s Flat Top twin-port OSFP Flat Top Direct Attached Copper cable (DAC)

It ensures stable 400Gbps throughput with high signal integrity and zero power consumption for ultra-short range connectivity

The module uses an IHS (Integrated Heat Sink) OSFP shell to satisfy the thermal requirements of high-density XDR switch environments

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